Wafer Cleaning

Refer To

cleaning after wafer cutting. The cleaning type, flow rate, rotation speed, cleaning time, cleaning position and cleaning process can be set arbitrarily through the human-machine interface to achieve effective and efficient cleaning Size Width*Depth*Height 500mm x 600mm x 1600mm

Main process description

● Set the cleaning process and parameters through the human-machine interface ● Put the wafer into the cleaning tank manually, cover the cleaning cover, and press Start to start cleaning ● After cleaning, take out the wafer manually

Product advantages

The equipment is equipped with 3 types of nozzles (gas nozzle, two-fluid nozzle, one-fluid nozzle) at the same time. Through intelligent switching, the cleaning type can be switched without stopping. In addition to the standard high-pressure cleaning nozzle, you can also choose water vapor two-fluid cleaning, cleaning liquid cleaning, clean gas spraying, and drying

Compatible

The two-fluid cleaning method combining water and air

Classification:

Semiconductor Solutions

Product Details

● Set the cleaning process and parameters through the human-machine interface
● Put the wafer into the cleaning tank manually, cover the cleaning cover, and press Start to start
cleaning
● After cleaning, take out the wafer manually

None

Wafer Glue Repair

0755-28905930

Mailbox:infor@winniceglobal.com
Shenzhen Headquarters: 5th Floor, Building 2, Kangli City, 66 Pingji Avenue, Nanwan Street, Longgang District, Shenzhen
Meizhou Factory: Meizhou Fengshun D-Win Ten Science and Technology Industrial Park

Scan Code

Business License