Wafer Glue Repair
Glue filling for wafers Size Width*depth*height 700mm x 400mm x 450mm
Manual wafer loading, equipment automatically fills the wafer with glue
● With glue barrel heating function ● Can quickly switch glue dispensing type
Easily clean
Dispensing components(with heating function）
Classification:
Semiconductor Solutions
Product Details
Manual wafer loading, equipment automatically fills the wafer with glue
Previous Page
Next Page
Previous Page
Test Sorting
Next Page
The equipment is equipped with 3 types of nozzles (gas nozzle, two-fluid nozzle, one-fluid nozzle) at the same time. Through intelligent switching, the cleaning type can be switched without stopping. In addition to the standard high-pressure cleaning nozzle, you can also choose water vapor two-fluid cleaning, cleaning liquid cleaning, clean gas spraying, and drying
Contact Us
Mailbox:infor@winniceglobal.com
Shenzhen Headquarters: 5th Floor, Building 2, Kangli City, 66 Pingji Avenue, Nanwan Street, Longgang District, Shenzhen
Meizhou Factory: Meizhou Fengshun D-Win Ten Science and Technology Industrial Park
Scan Code
Powered by www.300.cn