Test Sorting

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According to customer requirements, the corresponding fixture can be customized to adapt to different types of IC Size Width*depth*height 1200mm x 800mm x 2000mm

Main process description

The equipment automatically collects IC (diode, transistor, IC) through the test system, appearance inspection, foot length inspection, etc. into the tape to complete the processing Mainly composed of a turret structure

Product advantages

● High test accuracy, long service life, easy maintenance ● Use upper and lower air discs to supply materials, simple structure, easy maintenance

High test accuracy

Simple

Classification:

Semiconductor Solutions

Product Details


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Wafer Glue Repair

● With glue barrel heating function ● Can quickly switch glue dispensing type

Wafer Cleaning

The equipment is equipped with 3 types of nozzles (gas nozzle, two-fluid nozzle, one-fluid nozzle) at the same time. Through intelligent switching, the cleaning type can be switched without stopping. In addition to the standard high-pressure cleaning nozzle, you can also choose water vapor two-fluid cleaning, cleaning liquid cleaning, clean gas spraying, and drying